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Hans Klos at U2U: (LP)DDR4/5 Implementation with HyperLynx

March 26, 2024

Siemens EDA is hosting its annual User2User (U2U) conference, a premier event for professionals utilizing Siemens EDA products. This conference is an excellent opportunity for knowledge exchange and networking. Scheduled for May 7th, the event will take place in Munich, conveniently located near the airport.

We are pleased to announce that registration is now open and complimentary. Attendees are encouraged to review the event agenda to select presentations that align best with their interests and professional needs.

One of the highlights of this year’s conference is the participation of Hans Klos, CEO of Sintecs. Mr. Klos will offer his expert insights on the intricacies of DDR5 and LPDDR5 implementation and benefits HyperLynx gives. As high-speed design and the correct integration of DDR5 in new designs are critical topics on the market, as it follows from the SI consulting requests Sintecs receives.

DDR5, while offering significant enhancements in performance and power efficiency, presents notable challenges that need careful consideration, such as:

  1. Signal Integrity and Layout Complexity is higher due to DDR5’s increased speed and tighter timing margins, this requires more precise PCB design to maintain signal integrity. Issues like crosstalk, signal reflection, and timing skews are more pronounced, necessitating meticulous planning in trace layouts, impedance matching, and termination strategies.
  1. Power Management: The introduction of a new power management integrated circuit (PMIC) in DDR5 represents a leap in efficient power delivery but adds design complexity. Designers must ensure seamless integration of the PMIC with the memory and other system components, catering to specific power requirements and maintaining stable power delivery across different loads.
  1. Thermal Management: The enhanced performance of DDR5 may lead to increased heat generation, demanding effective thermal management solutions. This involves considering heat spreaders, optimized airflow, and potentially active cooling systems in the design.
  1. Compatibility and Interoperability: Integrating DDR5 necessitates compatibility checks with other system components like CPUs and chipsets. As not all processors or motherboards support DDR5, this can restrict design options or require additional components for compatibility.

Addressing these challenges requires a deep understanding of high-speed digital design, strategic component selection, and rigorous design and testing procedures. It involves balancing the advanced capabilities of DDR5 against the complexities and costs associated with its integration.

Join Siemens EDA and Sintecs at the U2U conference to delve into these topics and more, gaining valuable insights from industry leaders like Hans Klos.

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