HyperLynx
Solutions
HyperLynx DRC
HyperLynx DRC
HyperLynx® Design Rule Checking (DRC) provides fast, comprehensive electrical design verification to all PCB layout persons, hardware engineers, and SI/PI/EMC experts, regardless of their layout tool or level of expertise. It’s automated approach can be used iteratively, to identify design violations that lead to signal integrity, power integrity, and EMI/EMC issues, eliminating manual inspection and PCB cycle bottlenecks.
HyperLynx PI
HyperLynx PI
Identify potential power integrity distribution issues that can interfere with board design logic, and investigate and validate solutions in an easy-to-use, “what-if” environment with HyperLynx® PI.
Accurately model power distribution networks and noise propagation mechanisms during both pre- and post-layout phases in the PCB design process.
Accurately model power distribution networks and noise propagation mechanisms during both pre- and post-layout phases in the PCB design process.
HyperLynx SI
HyperLynx SI
HyperLynx Signal Integrity (SI) performs signal integrity analysis using automated workflows that make advanced analysis accessible to everyday PCB system designers. From pre-route design exploration and “what-if” analysis through detailed verification and sign-off to manufacturing, HyperLynx SI has you covered!
HyperLynx SI supports general-purpose SI, DDR interface signal integrity and timing analysis, power-aware analysis and compliance analysis for popular SerDes protocols, all with the fast, interactive analysis and ease of use and integration HyperLynx is known for. Want to reduce your design cycle and increase your chance of first-pass success with your next high-speed design? Use HyperLynx!
HyperLynx SI supports general-purpose SI, DDR interface signal integrity and timing analysis, power-aware analysis and compliance analysis for popular SerDes protocols, all with the fast, interactive analysis and ease of use and integration HyperLynx is known for. Want to reduce your design cycle and increase your chance of first-pass success with your next high-speed design? Use HyperLynx!
HyperLynx Full-Wave Solver
HyperLynx Full-Wave Solver
HyperLynx Full-Wave Solver delivers unprecedented speed and capacity through accelerated boundary element technology while preserving the gold-standard Maxwell accuracy. Achieve greater accuracy and fewer re-spins, even on the most complex structures.
Designers can take advantage of high speed, accuracy and capacity for signal integrity, power integrity and EMI concerns – all from within a common interface. The Full-Wave Solver is built from the ground up to exploit multi-core and hybrid architectures, and to utilize the best of fast solver technology to enable fast simulation on a single core or multiple cores.
Designers can take advantage of high speed, accuracy and capacity for signal integrity, power integrity and EMI concerns – all from within a common interface. The Full-Wave Solver is built from the ground up to exploit multi-core and hybrid architectures, and to utilize the best of fast solver technology to enable fast simulation on a single core or multiple cores.
HyperLynx Fast 3D Solver
HyperLynx Fast 3D Solver
HyperLynx Fast 3D Solver enables efficient, full package model creation with multi-processing for faster turnaround time. It is ideally suited for power integrity, low-frequency SSN/SSO, and complete-system SPICE model generation while accounting for skin effect impact on resistance and inductance.
Fast solver technologies enable rapid simulation on single and multiple cores. It is 20x-100x faster than other equivalent solutions and maintains full-3D gold-standard EMQS accuracy. The intuitive GUI enables users working with the latest system-in-package (SiP), package-on-package (PoP), stacked die, and multi-chip module (MCM) scenarios to easily extract accurate models with minimum extraneous effort on boundary conditions and port definitions.
Fast solver technologies enable rapid simulation on single and multiple cores. It is 20x-100x faster than other equivalent solutions and maintains full-3D gold-standard EMQS accuracy. The intuitive GUI enables users working with the latest system-in-package (SiP), package-on-package (PoP), stacked die, and multi-chip module (MCM) scenarios to easily extract accurate models with minimum extraneous effort on boundary conditions and port definitions.