Solving Supply Chain Issues Through Engineering

During the chip crisis in 2021–2022, supply chain issues were mostly about waiting. You placed an order, and if the lead time was 10 weeks, you adjusted your schedule and looked for alternative stock with faster delivery. While we hoped everything would eventually return to normal, in 2026 the problem isn’t just when the parts will arrive. It’s whether they will arrive at all.

For many OEMs, the challenge has shifted from simple delays to parts suddenly disappearing from the market completely. This is no longer just a headache for the purchasing department, it is a serious system-level engineering challenge that requires better control. We see this regularly in active customer projects, where component availability directly drives architectural and layout-level decisions.

Why Are Parts Disappearing Now?

If it feels like the market is more fragile than before, that’s because it is. We are seeing a mix of logistical, political and technological factors that are making standard components harder to get. Here is what is actually happening behind the scenes:

• The “AI Effect” on Manufacturing. You have likely seen the explosion in demand for high-end AI processors and DRAM memory. Additionally, these high-profit AI chips are taking up massive amounts of IC packaging capacity. This creates a bottleneck for everyone else, even if the silicon itself is available. In practice, we even see otherwise mature components becoming unavailable because their packaging or test flows compete with AI-focused production lines.
• Trade Wars & Export Rules. It is getting harder to move technology across borders. We are seeing cases where standard components that we used to buy without thinking, are suddenly restricted because of who owns the factory or where the headquarters are located. You might lose access to a vendor not because they stopped making the part, but because export licenses are no longer approved.
• Raw Material Tightness. New restrictions on materials like Gallium and Germanium are creating volatility for RF and power components. This affects prices and availability for the entire market, not just high-tech sectors.

The Engineering Reality of a Forced Switch

When a critical part goes “End-of-Life” (EOL) or becomes impossible to buy, you can’t always just find a drop-in replacement. Replacing a microcontroller or a power manager is rarely as simple as swapping a battery. It triggers a technical chain reaction:

• Software Issues: A new chip often means rewriting drivers or changing firmware.
• Physical Constraints: If the only available alternative comes in a different package (like switching from QFN to BGA), you have to redesign the PCB layout. And maybe to re-do SI and PI simulations.
• Hidden Risks: A new power regulator might have different noise characteristics. Suddenly, your device fails its EMC (electromagnetic compatibility) tests, and you have to spend weeks fixing it.

How to Build a “Resilient” Design

From our experience at Sintecs, the best way to handle this is to treat the supply chain as part of the design process. Here is a practical approach:

1. Don’t Design Yourself into a Corner. Avoid using “unique” or exotic parts unless you absolutely have to. If a chip is only made by one niche vendor, it’s a real risk.
2. Look for Real Alternatives (FFF). Having a backup part on your list (AVL) is only useful if it actually works. We recommend qualifying parts that are truly “Form, Fit, and Function” compatible. Try to pick backup parts from a manufacturer that uses a different factory. If both your main and backup suppliers rely on the same upstream foundry, you don’t really have a backup.
3. Stay On Top of Your Design. Don’t wait for the official “End of Life” email. Review your BOM’s from time to time (or request review from suppliers). Don’t hesitate to use specialized applications to catch warning signs, like when a part is marked “Not Recommended for New Design” (NRND) or when a manufacturer’s delivery times become unstable.

When You Have to Redesign

Sometimes, despite your best efforts, you hit a wall. You have to redesign a board to keep a product alive. The danger here is speed. When you rush a redesign to get production running again, and ordered PCB materials are already waiting at factory.

Under time pressure, even small layout or component-level changes can have unintended side effects. A slightly different pinout, a change in the return path, or altered decoupling behaviour can introduce signal integrity or EMC issues that were not present in the original design. This is where Sintecs can help. We treat these “rescue redesigns” as precision engineering projects, providing:

• Feasibility Checks: Quickly confirming if the new part will electrically, physically and thermally fit your device.
• Verification: Checking that the new layout won’t cause signal timing errors or power issues.
• Compliance Safety: We simulate the changes to make sure you won’t fail your EMC certification because of the new components.

Your Design Checkup Options

Every supply chain challenge is unique. If you are worried that a missing component might impact your production, you need a clear assessment of the risks before your BOM becomes a problem. We invite you to reach out for a free, non-binding consultation. We’re happy to discuss your specific situation and share how we would approach it from an engineering perspective. For the fastest response, email us at communications@sintecs.eu