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How to Kick-Off SI & PI Simulations

October 7, 2024

To ensure the integrity of high-speed electronic designs, both Signal Integrity (SI) and Power Integrity (PI) simulations are essential. Whether you’re using Altium, Cadence, Zuken, or Siemens EDA (ex-Mentor Graphics), this guide will help you gather the necessary data for launching successful simulations using HyperLynx SI/PI with or without support from Sintecs’ engineering team. Follow the specific instructions for your EDA tool to ensure all critical information is ready for analysis.

What You Need for SI and PI Simulations

Below are the specific instructions for each EDA tool on what to provide for successful SI and PI simulations.

1. Altium Designer

  • Altium Design Container
    The complete design file (including schematics, layout, and netlist) provides all the necessary data in one package. If this is available, it’s the most straightforward option.
  • Alternative:
    • PDF of Schematics – This gives us an overview of the design for manual review.
    • HyperLynx Export – Altium supports exporting to HyperLynx-compatible formats. However, this may require additional manual input, which can be done using our HyperLynx Connector tool.
    • ODB++ Output – This file format contains manufacturing data, netlists, and board layer information essential for physical and electrical characteristics.

2. Cadence Allegro

  • Allegro Design Database (.brd)
    The full board file from Allegro contains all the necessary design data for both SI and PI simulations. This file includes the layout, netlist, and component information.
  • Alternative:
    • PDF of Schematics – A schematic overview in PDF is useful for reference.
    • Sigrity (or HyperLynx) Export – Export the design for use in SI/PI tools like HyperLynx. Allegro integrates well with simulation tools, but an export ensures compatibility.
    • ODB++ Output – A standard ODB++ output from Cadence, containing manufacturing information and stackup data.

3. Zuken CR-8000

For Zuken CR-8000 users, the following data should be provided:

  • CR-8000 Design File (.cdb)
    The native design file from Zuken contains the layout, netlist, and stackup information, which is essential for simulations.
  • Alternative:
    • PDF of Schematics – A PDF version of the schematics helps cross-reference the design.
    • HyperLynx Export – Zuken CR-8000 supports exporting to formats compatible with HyperLynx SI/PI. This export may need to be supplemented with additional data.
    • ODB++ Output – Like other tools, Zuken’s ODB++ output provides key manufacturing and layer data.

4. Siemens EDA (Xpedition/PADS)

  • Xpedition, PADS Professional or PADS Design Database
    The native design file from Xpedition, PADS Professional or PADS contains all the necessary data, including layout, netlist, and component details.
  • Alternative:
    • PDF of Schematics – A PDF version of the schematics is useful for verification.
    • HyperLynx Export – Siemens EDA offers seamless integration with HyperLynx, but ensure that the export is correctly configured to include necessary stackup and component information.
    • ODB++ Output – The ODB++ format provides essential manufacturing and stackup data.

Common Data for All EDA Tools

In addition to the design files from your specific EDA tool, please provide the following:

  • Stackup Information – A detailed layer stackup description including materials, layer thickness, and order. This can often be exported or manually compiled from your EDA tool.
  • Bill of Materials (BOM) – A full BOM listing all components, including component types, manufacturers, and part numbers. This ensures that we use accurate models during simulations.
  • Power Overview for Each Rail – A clear breakdown of power rails, including current demand per rail, is essential for power integrity analysis. This can often be derived from your EDA tool’s power management or power net data (see the example below).
  • Timing Parameters or Datasheets – If working with high-speed interfaces such as LPDDR, provide timing parameters or the relevant datasheet that outlines AC switching characteristics.
  • IBIS Models – IBIS models for key components (e.g., CPU, memory) help accurately simulate signal integrity. These are typically available from component manufacturers or integrated within your EDA tool.

Setting Up HyperLynx for SI/PI

Once you’ve provided the necessary data from your chosen EDA tool, we proceed with:

  • Data Verification and Integration
    We check that the data is complete and ready for simulation. If there are gaps, our HyperLynx Connector tool helps bridge those, especially if manual data input is required.
  • Simulation Setup
    Based on the provided data (stackup, BOM, power overview, timing parameters), we configure the simulations to address specific design challenges like signal crosstalk, power noise.
  • Simulation Execution and Analysis
    After running the simulations, we provide detailed reports on any potential issues and recommend design changes to optimize the integrity of your signals and power distribution network.

Why Choose Sintecs?

At Sintecs, we offer deep expertise across a wide range of design tools, including Altium, Cadence Allegro, Zuken CR-8000, and Siemens EDA. We provide a tailored approach to SI/PI analysis, ensuring that your designs are optimized for performance and reliability.

Contact us today to get started with your SI and PI simulations, and ensure your designs meet the highest standards of quality and performance.

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