Baltic PCB & Systems Conference 2025: Key Highlights
Conference overview
The Baltic PCB & Systems Conference 2025 has successfully concluded, bringing together the Baltic and European electronics engineering community to discuss practical challenges in PCB design, systems engineering, and electronics manufacturing.
The conference gathered 131 participants across 13 technical presentations, covering the full path from chips to systems, including SI/PI design, digital twin methodologies, wireless technologies, AI in electronic design, and PCB manufacturing in Europe. In parallel, a dedicated student track hosted 21 students, strengthening collaboration between academia and industry.
Conference topics and technical sessions
The program focused on real-world engineering topics relevant to modern electronics design and production (alphabet order):
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Bluetooth 6: from Wireless Audio to Precise Spatial Awareness
Szabolcs Barna, Arrow Electronics -
Breaking Down PCB Cost
Sergey Zorin, Dannie.cc -
Building a Wireless SOM
Aidas Urbanas, 8devices -
DFT and test strategy for high-performance FPGA boards
Artur Jutman, Testonica Lab -
Electronic design process with AI
Hans Klos, Sintecs -
From Chips to Systems
Gediminas Račiukaitis, ChipsC²-LT -
Hardware design methods for building a CRA-ready device
Arnas Celkys, EBV Elektronik -
High Bandwidth Constant Impedance PCB Interconnects With Components
Aleksandr Vasjanov, Vilnius Tech / ChipsC²-LT -
PCB made in Europe
Vytautas Ilgūnas, TLT PCB -
Shielding solutions applied on PCB for reduction of electrical and magnetic fields
Piotr Gierwiatowski, Würth Elektronik -
SI/PI fundamentals for designers
André Dekker, Sintecs -
Target First Time Right Electronics Systems Through Digital Twin
Olivier Arnaud, Siemens EDA -
Wireless, Meet Compliance: Try Not to Fight on Stage
Valerijus Zlosnikas, Systec Designas
These sessions reflected current trends in PCB design conferences, with a strong emphasis on manufacturability, reliability, compliance, and system-level thinking.
Participant feedback and key numbers
Early feedback already indicates a high level of satisfaction with the event. 75% of respondents stated they would be very likely to recommend the conference, while 25% indicated they would be likely to recommend it. This confirms the relevance of the topics and the practical value of the conference format.
But engineering conferences are measured not only by content, but also by the atmosphere and networking:
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242 kibinai and other snacks were enjoyed
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52 liters of coffee supported full-day technical discussions
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6 liters of kvass added a local touch
Conference partners
We would like to sincerely thank the conference partners who supported the event with technology, expertise, and practical insight:
Their contribution added significant value to the technical program and discussions.
Organizational partners
Special thanks go to our organizational partners:
Your support and collaboration were essential in delivering a high-quality PCB and systems engineering conference in the Baltic region.
Photo report from the event
Here is the extended photo report from the Baltic PCB & Systems Conference 2025:
Valerijus Zlosnikas (Systec Designas), Gediminas Račiukaitis (ChipsC²-LT), Arturas Medeisis (Vilnius Tech)
Mini-booth of Arrow Electronics
André Dekker from Sintecs is presenting
Thilo Hentschke from Siemens EDA is presenting for students
Thilo Hentschke (Siemens EDA), Hans Klos (Sintecs), Olivier Arnaud (Siemens EDA)
Gediminas Račiukaitis (ChipsC²-LT)
See you in 2026!
Sintecs Team.
