Expertise in Computer Vision Hardware Solutions
Sintecs specializes in advanced hardware solutions for video capture, transmission, and processing. Our expertise spans from compact, industrial-grade video cameras with complex thermal and mechanical constraints to sophisticated systems used in particle detection and high-speed imaging.
We engineer custom video acquisition cards (frame grabbers) that support multi-channel capture, advanced buffering, and real-time pre-processing ready for high-performance computer vision applications.
Our electronic boards reflect the commitment of Sintecs to innovation and high-speed PCB design. We support a broad range of interfaces, including PCI Express, Camera Link (PoCL), CoaXPress, LVDS, and HD-SDI, offering maximum compatibility and flexibility for modern vision systems.
By leveraging the latest Xilinx (AMD), Microchip and Intel FPGA platforms, we develop custom firmwares meeting specific functional and data throughput requirements. Together with embedded software for automation and control, our solutions address the critical challenges of real-time data handling, security, power efficiency.
Industry partners
Industry Challenges Solutions from Sintecs
| Providing High Real-Time Processing Perofrmance | – High-speed PCB layouts for demanding data loads – Integration of GPUs and cutting-edge FPGAs – System-level thermal simulation at all R&D stages – Co-design with software teams to align hardware with algorithmic needs |
| Achieving Cost-Efficiency | – Reduced R&D costs via fewer design spins – Proven design patterns from hundreds of projects – Optimized selection of components and technologies |
| Ensuring Data Privacy & Security | – Hardware-level cybersecurity implementations – Experience in critical infrastructure projects – Secure embedded software solutions |
| Decreasign Power Consumption | – Low-power components and efficient circuitry – Dynamic power control and advanced sleep modes – Intelligent load balancing via software |
| Allowing Scalability | – Future-proof design with modular expansion in mind – Support for scalable industry-standard interfaces |
| Product Long-Term Reliability | – Use of industrial-grade components – Robust design practices with built-in safety margins |
| Efficient Thermal Management | – Integrated heat dissipation features from the start – Advanced thermal simulation: pre-layout and post-layout – Passive and active cooling option |
| Component Integration | – Expertise in sensor/GPU/camera integration – Custom boards for efficient image data routing and processing |
CASE STUDY:
High-Speed CoaXPress Frame Grabber
Objective: Design a frame grabber supporting CoaXPress-12 (CXP-12) Quad at 12.5 Gbps per channel.
Solution:
- Performed SI/PI simulations for clean signal transmission.
- Built advanced heat-spreading architecture.
- Managed multiple high-speed video streams.
Results:
- 50 Gbps+ aggregate capture rate
- Passes SI/PI tests under peak loads
- Stable thermal behavior during continuous operation
CASE STUDY:
Power Optimization for Compact Night Vision Device
Objective: Redesign a high-density PCB for 24/7 field use with optimized power and thermal performance.
Solution:
- Integrated over 1,000 components on a compact board with blind and buried vias.
- Conducted thermal simulations (pre- and post-layout) for continuous use.
- Used ultra-low-power design techniques to maximize battery life.
Results:
- Extended operational time without overheating.
- 30% improved power efficiency.
- Reliable thermal performance in harsh field conditions.
CASE STUDY:
Redesigning Legacy Camera Boards
Objective: Upgrade legacy professional TV broadcast camera boards while maintaining performance and layout compatibility.
Solution:
- Managed 2,500–3,100 components across 20+ layers.
- Retained critical layout areas while modernizing parts.
- Handled simultaneous schematic and layout updates.
Results:
- Seamless upgrade without breaking compatibility.
- Maintained high-speed support for USB, DDR4, PCIe.
- Successfully integrated into new camera systems.